Preparation of Your Final Manuscript
The final camera-ready manuscript of your paper should account for all the critical reviewers’ feedback. Should you need to change the title or the abstract to account for such comments, then please request approval from both the TPC and your Track or Special-Session Co-Chairs before proceeding with such changes.
Should you have forgotten to list on the EDAS registration page of your paper a co-author clearly identified so in your review manuscript’s PDF, please report the issue both to the TPC and your Track or Special-Session Co-Chairs and request permission to have the missing name added on EDAS.
Please be advised that your manuscript should strictly comply with the very same paper template specified at the submission phase. Please refer to the detailed instructions given under the appropriate conference CFP webpage.
Registration as an Author on EDAS
Upload of Your Manuscript on EDAS
Once you complete your author registration on EDAS, you will be allowed to upload all manuscripts (up to three) you have covered as a co-author. If any paper exceeds the page limit during submission, the author is automatically directed to an EDAS webpage which allows you to pay for applicable over-length fees of up to two extra pages in excess of five (cf. above).
If you encounter any upload problem related to the payment of your author registration or over-length fees, please submit it by email to the EDAS Help Desk at
Submission of Your Manuscript Copyright Form
Please login to your EDAS account and look for your IEEE ITCE 2019 accepted paper under your EDAS dashboard, then click on the copyright icon as illustrated below. You will be then directed to an EDAS webpage in which you should click on the button “IEEE Copyright Submission” as illustrated below. You will be then redirected to IEEE eCF website where you will be able to easily complete and submit your copyright form online. Please do so no later than 15 December 2019 23:59 EDT as this step is compulsory for paper inclusion in the technical program and its submission for publication by IEEE Xplore®.